Patent Assignment
Reel/Frame 055157/0543
Assignment of Assignor's Interest
Recorded: 2021-02-05
Pages: 6
Assignors
PARK, JINWOO
Executed: 2021-01-20
KANG, UNBYOUNG
Executed: 2021-01-20
LEE, JONGHO
Executed: 2021-01-20
LEE, TEAKHOON
Executed: 2021-01-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Structures Having Underfills