Patent Assignment
Reel/Frame 055172/0775
Assignment of Assignor's Interest
Recorded: 2021-02-07
Pages: 8
Assignors
HUANG, YU-LIEN
Executed: 2020-10-05
FU, CHING-FENG
Executed: 2020-10-05
WANG, GUAN-REN
Executed: 2020-10-05
HSU, CHE-MING
Executed: 2020-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO.8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 30077, TAIWAN
Covered Property
(1)
Interconnect Structures for Semiconductor Devices and Methods of Manufacturing the Same