Interconnect structures for semiconductor devices and methods of manufacturing the same
A method for making a semiconductor device includes forming a first patterned structure over an interlayer dielectric. The interlayer dielectric overlays a first source/drain structure and a second source/drain structure. The first patterned structure extends along a first lateral direction and a vertical projection of the first patterned structure is located between the first and second source/drain structures along a second lateral direction perpendicular to the first lateral direction. The method includes reducing a width of the first patterned structure that extends along the second lateral direction. The method includes forming, based on the first patterned structure having the reduced width, contact holes that expose the first source/drain structure and the second source/drain structure, respectively.
1. A method for making a semiconductor device, comprising:
forming a first patterned structure over an interlayer dielectric, wherein the interlayer dielectric overlays a first source/drain structure and a second source/drain structure, and wherein the first patterned structure extends along a first lateral direction and a vertical projection of the first patterned structure is located between the first and second source/drain structures along a second lateral direction perpendicular to the first lateral direction;
reducing a width of the first patterned structure that extends along the second lateral direction; and
forming, based on the first patterned structure having the reduced width, contact holes that expose the first source/drain structure and the second source/drain structure, respectively.
2. The method of claim 1 , wherein the method further comprises, prior to the step of reducing a width of the first patterned structure:
depositing at least one imaging layer over the interlayer dielectric; and
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the first patterned structure.
3. The method of claim 2 , wherein the step of reducing a width of the first patterned structure comprises etching the central portion of the first patterned structure through the trench, while clamping end portions of the first patterned structure with the at least one imaging layer.
4. The method of claim 1 , further comprising filling the contact holes with a metal material to form a first interconnect structure and a second interconnect structure that electrically connect to the first and second source/drain structures, respectively.
5. The method of claim 4 , wherein the first and second interconnect structures are electrically isolated from each other by a portion of the interlayer dielectric that is vertically projected from the first patterned structure.
6. The method of claim 1 , wherein the width of the first patterned structure is reduced by at least about 1 nanometer (nm).
7. The method of claim 1 , wherein the method further comprises, following the step of reducing a width of the first patterned structure:
depositing at least one imaging layer over the interlayer dielectric; and
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the first patterned structure.
8. The method of claim 1 , wherein the method further comprises, prior to the step of reducing a width of the first patterned structure:
forming a second patterned structure over the interlayer dielectric, wherein the second patterned structure extends along the first lateral direction and a vertical projection of the second patterned structure is located between the first and second source/drain structures along the second lateral direction;
depositing at least one imaging layer over the interlayer dielectric;
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the second patterned structure; and
forming the first patterned structure using the second patterned structure.
9. The method of claim 1 , wherein the step of forming contact holes comprises etching the interlayer dielectric using a dry etching process that includes an etchant selected from the group consisting of: carbon tetrafluoride (CF 4 ), hexafluoro-1,3-butadiene (C 4 F 6 ), octafluorocyclobutane (C 4 F 8 ), and oxygen (O 2 ).
10. A method for making a semiconductor device, comprising:
forming an interlayer dielectric to overlay a first source/drain structure and a second source/drain structure;
forming a first patterned structure over the interlayer dielectric, wherein the first patterned structure extends along a first lateral direction and a vertical projection of the first patterned structure on the interlayer dielectric is located between the first and second source/drain structures along a second lateral direction perpendicular to the first lateral direction;
trimming the first patterned structure, thereby causing a width of the first patterned structure that extends along the second lateral direction to be reduced; and
etching the interlayer dielectric to form contact holes that expose the first source/drain structure and the second source/drain structure, respectively, based on the trimmed first patterned structure such that widths of the contact holes along the second lateral direction are respectively enlarged.
11. The method of claim 10 , wherein the method further comprises, prior to the step of trimming the first patterned structure:
depositing at least one imaging layer over the interlayer dielectric; and
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the first patterned structure.
12. The method of claim 11 , wherein the step of trimming the first patterned structure comprises etching the central portion of the first patterned structure through the trench, while clamping end portions of the first patterned structure with the at least one imaging layer.
13. The method of claim 10 , further comprising filling the enlarged contact holes with a metal material to form a first interconnect structure and a second interconnect structure that electrically connect to the first and second source/drain structures, respectively.
14. The method of claim 13 , wherein respective widths of the first and second interconnect structures are enlarged along the second lateral direction such that respective contact resistances of the first and second interconnect structures are reduced.
15. The method of claim 10 , wherein the method further comprises, following the step of trimming the first patterned structure:
depositing at least one imaging layer over the interlayer dielectric; and
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the first patterned structure.
16. The method of claim 10 , wherein the method further comprises, prior to the step of trimming the first patterned structure:
forming a second patterned structure over the interlayer dielectric, wherein the second patterned structure extends along the first lateral direction and a vertical projection of the second patterned structure is located between the first and second source/drain structures along the second lateral direction;
depositing at least one imaging layer over the interlayer dielectric;
forming a trench in the at least one imaging layer that extends along the second lateral direction and exposes a central portion of the second patterned structure; and
forming the first patterned structure using the second patterned structure.
17. The method of claim 9 , wherein the step of etching the interlayer dielectric comprises performing a dry etching process that includes an etchant selected from a group consisting of: carbon tetrafluoride (CF 4 ), hexafluoro-1,3-butadiene (C 4 F 6 ), octafluorocyclobutane (C 4 F 8 ), and oxygen (O 2 ).
18. A method for making a semiconductor device, comprising:
forming an interlayer dielectric to overlay a first source/drain structure and a second source/drain structure that are separated from each other along a first lateral direction;
forming a patterned structure over the interlayer dielectric, wherein the patterned structure is located between the first and second source/drain structures along the first lateral direction;
clamping end portions of the patterned structure located along a second lateral direction that is perpendicular to the first lateral direction;
reducing a width of the patterned structure that extends along the first lateral direction; and
etching the interlayer dielectric to form contact holes that expose the first source/drain structure and the second source/drain structure, respectively, based on the patterned structure having the reduced width such that a distance between respective inner sidewalls of the contact holes, which are separated by the interlayer dielectric, is shrunk.
19. The method of claim 18 , wherein the step of clamping end portions of the patterned structure further comprises:
depositing at least one imaging layer over the interlayer dielectric; and
forming a trench in the at least one imaging layer that extends along the first lateral direction and exposes a central portion of the patterned structure, while clamping the end portions using a remaining portion of the at least one imaging layer.
20. The method of claim 18 , wherein the width of the patterned structure is reduced by at least about 1 nanometer (nm).