IP Library › Assignment 055178/0669
Patent Assignment
Reel/Frame 055178/0669

Assignment of Assignor's Interest

Recorded: 2021-02-08 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-22
CARNEY, FRANCIS J.
Executed: 2016-08-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Through-Substrate via Structure and Method of Manufacture
Application: 17/248,784 →
Publication: US 2021/0167002
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 15, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 056595/0177 →
Release of Security Interest in Patents Previously Recorded at Reel 056595, Frame 0177 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0564 →