Patent Assignment
Reel/Frame 055203/0461
Assignment of Assignor's Interest
Recorded: 2021-02-02
Pages: 5
Assignors
TUNG, YUEH-MING
Executed: 2021-01-26
YANG, CHIA-MING
Executed: 2021-01-26
CHEN, JUNG-WEI
Executed: 2021-01-26
LEU, JIAN-DE
Executed: 2021-01-26
PAN, GUAN-LIN
Executed: 2021-01-26
Assignee
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
NO. 9, CENTRAL 3RD ST., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Package Comprising Heat Spreader