Manufacturing method of semiconductor package comprising heat spreader

1. A method of manufacturing a semiconductor package, comprising:

providing a redistribution layer having opposing first surface and second surface;

disposing a die on the first surface of the redistribution layer and electrically connecting the die to the redistribution layer;

disposing a heat spreader on the die;

forming a molding layer with a molding material on the redistribution layer to cover side surfaces of the die;

removing the molding material from a top surface of the heat spreader thereby exposing the heat spreader;

coating a metal layer as a protective layer on the exposed heat spreader;

forming a mask on the second surface of the redistribution layer;

performing a chemical or plasma etching process on the second surface of the redistribution layer to expose conductive traces in the redistribution layer;

removing the mask; and

forming a plurality of conductive bumps on the second surface of the redistribution layer and electrically connecting the plurality of conductive bumps to the exposed conductive traces in the redistribution layer.

2. The method as claimed in claim 1 , wherein the heat spreader is provided with a plurality of through holes formed thereon, the molding material being further filled in the plurality of through holes of the heat spreader.

3. The method as claimed in claim 1 , wherein the heat spreader extends beyond periphery of the die.

4. The method as claimed in claim 3 , wherein the molding layer is further formed between the heat spreader and the redistribution layer.