Patent Assignment
Reel/Frame 055217/0261
Assignment of Assignor's Interest
Recorded: 2021-02-10
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heat Sink Layout Designs for Advanced Finfet Integrated Circuits