Patent Assignment
Reel/Frame 055232/0577
Assignment of Assignor's Interest
Recorded: 2021-02-11
Pages: 4
Assignors
KANEKO, HARUKA
Executed: 2021-02-05
ARITA, TAKEHIKO
Executed: 2021-02-08
SAKAI, HAYATO
Executed: 2021-02-05
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method