IP Library › Granted Patent US 11,817,334
Granted Patent B2
US 11,817,334 · App. 17/173,566 · Granted Nov 14, 2023

Substrate processing apparatus and substrate processing method

Inventors: Haruka Kaneko (Miyagi, JP); Takehiko Arita (Miyagi, JP); Hayato Sakai (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/67248H01L21/67109H01L21/67253H05B3/0014
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Quick Facts
Patent No.
US 11,817,334
App. No.
17/173,566
Granted
Nov 14, 2023
Kind
B2
Abstract

A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.

Claims (68)

1. A system of processing a substrate, comprising:

substrate-processing chambers;

target components of temperature control disposed in the respective substrate-processing chambers;

a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components;

flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller,

wherein the chiller comprises a first thermoregulator to control the first temperature-controlling medium to a first temperature and a second thermoregulator to control the second temperature-controlling medium to a second temperature, the second temperature being higher than the first temperature,

the first thermoregulator has a first inlet port to supply the controlled first temperature-controlling medium to the respective target components and the first outlet port to recover the first temperature-controlling medium from the target components, and

the second thermoregulator has a second inlet port to supply the controlled second temperature-controlling medium to the respective target components and the second outlet port to recover the second temperature-controlling medium from the target components,

wherein the system further comprises:

first supply channels disposed between the first inlet port and the flow controllers, respectively;

first recovery channels disposed between the first outlet port and the flow controllers, respectively;

second supply channels disposed between the second inlet port and the flow controllers, respectively; and

second recovery channels disposed between the second outlet port and the flow controllers, respectively,

wherein the first inlet port and the first outlet port are disposed in a center of the first thermoregulator;

the first supply channels have a first height, and the first recovery channels have a second height differing from the first height;

the second inlet port and the second outlet port are disposed in a center of the second thermoregulator; and

the second supply channels have a third height, and the second recovery channels have a fourth height differing from the third height.

2. The system according to claim 1 , wherein

the first supply channels have an identical length;

the first recovery channels have an identical length;

the second supply channels have an identical length; and

the second recovery channels have an identical length.

3. A system of processing a substrate, comprising:

substrate-processing chambers;

target components of temperature control disposed in the respective substrate-processing chambers;

a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components;

flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller,

wherein the chiller comprises a first thermoregulator to control the first temperature-controlling medium to a first temperature and a second thermoregulator to control the second temperature-controlling medium to a second temperature, the second temperature being higher than the first temperature;

the first thermoregulator has a first inlet port to supply the controlled first temperature-controlling medium to the respective target components and the first outlet port to recover the first temperature-controlling medium from the target components;

the second thermoregulator has a second inlet port to supply the controlled second temperature-controlling medium to the respective target components and the second outlet port to recover the second temperature-controlling medium from the target components,

wherein the system further comprises:

first supply channels disposed between the first inlet port and the flow controllers, respectively;

first recovery channels disposed between the first outlet port and the flow controllers, respectively;

second supply channels disposed between the second inlet port and the flow controllers, respectively; and

second recovery channels disposed between the second outlet port and the flow controllers, respectively,

wherein the first thermoregulator includes a first supply manifold and a first recovery manifold that have a polygonal shape in planar view;

the first supply channels, respectively, extend from the first inlet port to the flow controllers, through the first supply manifold;

the first recovery channels, respectively, extend from the first recovery port to the flow controllers, through the first recovery manifold;

the second thermoregulator includes a second supply manifold and a second recovery manifold that have a polygonal shape in planar view;

the second supply channels, respectively, extend from the second inlet port to the flow controllers, through the second supply manifold; and

the second recovery channels, respectively, extend from the second recovery port to the flow controllers, through the second recovery manifold.

4. The system according to claim 3 , wherein

the first supply channels being divergent from the first supply manifold and extending to the respective flow controllers have an identical length;

the first recovery channels being divergent from the first recovery manifold and extending to the respective flow controllers have an identical length;

the second supply channels being divergent from the second supply manifold and extending to the respective flow controllers have an identical length; and

the second recovery channels being divergent from the second recovery manifold and extending to the respective flow controllers have an identical length.

5. The system according to claim 4 , wherein

the first thermoregulator is disposed below the second thermoregulator.

6. The system according to claim 5 , further comprising:

a transfer module to transfer the substrate, wherein

the substrate-processing chambers are connected to the transfer module; and

the chiller is disposed below the transfer module.

7. The system according to claim 5 , further comprising:

a chiller module accommodating the chiller and flow controllers, the chiller module having a flat top face.

8. The system according to claim 4 , wherein

the substrate-processing chamber are disposed on a floor;

the first thermoregulator is disposed below the floor; and

the second thermoregulator is disposed above the floor.

9. The system according to claim 8 , wherein

the target component is one selected from a group consisting of a substrate support for holding the substrate in the substrate-processing chamber, an electrode provided at an upper portion of the substrate-processing chamber, and a sidewall of the substrate-processing chamber.

10. The system according to claim 8 , wherein

the target component is provided with a thermosensor to measure a temperature of the target component; and

a controller controls the flow controller in response to the temperature observed by the thermosensor.

11. The system according to claim 3 , wherein

the first supply channels have an identical length;

the first recovery channels have an identical length;

the second supply channels have an identical length; and

the second recovery channels have an identical length.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2021
From: KANEKO, HARUKA; ARITA, TAKEHIKO; SAKAI, HAYATO
To: TOKYO ELECTRON LIMITED
Reel/Frame 055232/0577 →
Priority Claims (1)
JP 2020-026260 · Feb 19, 2020 · national
Continuity (1)
Related Publication 20210257235A1 · Aug 19, 2021
Cited By (1)
US 12,500,101