IP Library › Assignment 055245/0592
Patent Assignment
Reel/Frame 055245/0592

Assignment of Assignor's Interest

Recorded: 2021-02-12 Pages: 7
Assignors
YU, AIBIN
Executed: 2014-09-23
ZHOU, WEI
Executed: 2014-09-23
MA, ZHAOHUI
Executed: 2014-09-23
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Bond Pad with Micro-Protrusions for Direct Metallic Bonding
Application: 17/174,827 →
Publication: US 2021/0175194