Patent Assignment
Reel/Frame 055248/0089
Assignment of Assignor's Interest
Recorded: 2021-02-12
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2020-08-05
TSAI, CHUNG-HAO
Executed: 2020-08-04
WANG, CHUEI-TANG
Executed: 2020-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method