Patent Assignment
Reel/Frame 055300/0067
Assignment of Assignor's Interest
Recorded: 2021-02-17
Pages: 3
Assignor
FANG, HSU-NAN
Executed: 2021-02-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure and Method for Manufacturing the Same