Package structure and method for manufacturing the same
A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.
1. A package structure, comprising:
an electronic device;
a heat spreader;
an intermediate layer interposed between the electronic device and the heat spreader, wherein the intermediate layer includes a sintered material, wherein the intermediate layer is a thermal interface material; and
an encapsulant encapsulating the electronic device, wherein the electronic device includes a plurality of electrical contacts, and a surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.
2. The package structure of claim 1 , further comprising a bonding promoter interposed between the electronic device and the intermediate layer.
3. The package structure of claim 2 , further comprising a plurality of intermetallic compounds (IMCs) disposed at an interface between the bonding promoter and the intermediate material, wherein the intermediate layer includes a plurality of metal particles and the bonding promoter comprises a metal layer.
4. The package structure of claim 1 , wherein the encapsulant encapsulates the intermediate layer.
5. The package structure of claim 1 , wherein the electrical contacts include bumps or pillars.
6. The package structure of claim 1 , wherein a Young's modulus of the intermediate layer is greater than 0.3 GPa.
7. The package structure of claim 1 , wherein a thermal conductivity of the intermediate layer is greater than 10 W/K.
8. A package structure, comprising:
an electronic device;
a heat spreader;
an intermediate layer interposed between the electronic device and the heat spreader, wherein the intermediate layer includes a sintered material; and
an encapsulant encapsulating the electronic device, wherein a portion of the electronic device is embedded in the intermediate layer.
9. The package structure of claim 8 , wherein a portion of the intermediate layer is in contact with a portion of a lateral side surface of the electronic device.
10. A package structure, comprising:
a first electronic device;
a second electronic device;
a reinforcement layer 11 covering the first electronic device, the second electronic device and a gap between the first electronic device and the second electronic device, wherein the reinforcement layer includes a sintered material; and
a wiring structure electrically connected to the first electronic device and the second electronic device.
11. The package structure of claim 10 , further comprising a heat spreader, wherein the reinforcement layer is attached to the heat spreader.
12. The package structure of claim 10 , wherein the reinforcement layer includes a thermal interface material and is in contact with the first electronic device and the second electronic device.
13. The package structure of claim 12 , wherein the reinforcement layer is in contact with a portion of a lateral side surface of the first electronic device and a portion of a lateral side surface of the second electronic device.
14. The package structure of claim 10 , further comprising an encapsulant encapsulating the first electronic device and the second electronic device, wherein the first electronic device includes a plurality of first electrical contacts, the second electronic device includes a plurality of second electrical contacts, and a surface of the encapsulant is substantially coplanar with a plurality of surfaces of the first electrical contacts and a plurality of surfaces of the second electrical contacts.