Patent Assignment
Reel/Frame 055358/0858
Assignment of Assignor's Interest
Recorded: 2021-02-22
Pages: 4
Assignors
KUNG, CHENG-YUAN
Executed: 2020-12-09
LIN, HUNG-YI
Executed: 2020-12-09
HSIEH, MENG-WEI
Executed: 2020-12-08
TSAI, YU-PIN
Executed: 2020-12-09
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same