Semiconductor package structure and method for manufacturing the same
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.
1. A semiconductor package structure, comprising:
a device package comprising an electronic device unit and having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface; and
a shielding layer disposed on the first surface and the second surface of the device package;
wherein a common edge of the second surface and the third surface comprises a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface comprises a second portion exposed from the shielding layer by a second length that is different from the first length, and
wherein the device package further has a fourth surface connected to the second surface, and a common edge of the second surface and the fourth surface comprises a third portion exposed from the shielding layer by a third length that is different from the first length.
2. The semiconductor package structure as claimed in claim 1 , wherein the device package further comprises:
an encapsulant encapsulating the electronic device unit; and
a redistribution layer on the encapsulant, wherein a first edge of the redistribution layer comprises the first portion.
3. The semiconductor package structure as claimed in claim 2 , wherein a second edge of the redistribution layer comprises the second portion.
4. The semiconductor package structure as claimed in claim 2 , wherein the redistribution layer comprises a grounding element exposed from a lateral surface and contacting the shielding layer.
5. The semiconductor package structure as claimed in claim 1 , wherein the shielding layer comprises a first portion on the first surface of the electronic device unit and a second portion on the second surface of the electronic device unit, and an extending length of the first portion is less than an extending length of the second portion.
6. A semiconductor package structure, comprising:
a device package comprising an electronic device unit and having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface; and
a shielding layer disposed on the first surface and the second surface of the device package;
wherein a common edge of the second surface and the third surface comprises a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface comprises a second portion exposed from the shielding layer by a second length that is different from the first length,
wherein the shielding layer comprises a first portion on the first surface of the electronic device unit and a second portion on the second surface of the electronic device unit, and an extending length of the first portion is less than an extending length of the second portion, and
wherein the second portion of the shielding layer has an inclined bottom surface.
7. The semiconductor package structure as claimed in claim 6 , wherein a bottom surface of the first portion of the shielding layer substantially aligns with a bottom surface of a grounding element.
8. A semiconductor package structure, comprising:
a device package comprising an electronic device unit and having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface; and
a shielding layer disposed on the first surface and the second surface of the device package;
wherein a common edge of the second surface and the third surface comprises a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface comprises a second portion exposed from the shielding layer by a second length that is different from the first length, and
wherein a portion of the second surface is exposed from the shielding layer and has a tapered shape.
9. The semiconductor package structure as claimed in claim 8 , wherein the device package further has a fourth surface opposite to the third surface, and the portion of the second surface tapers from the third surface towards the fourth surface.
10. The semiconductor package structure as claimed in claim 8 , wherein the device package further comprises:
an encapsulant encapsulating the electronic device unit; and
an insulating layer disposed over the electronic device unit and the encapsulant.
11. The semiconductor package structure as claimed in claim 10 , wherein a lateral surface of the insulating layer is substantially coplanar with a lateral surface of the encapsulant.