Patent Assignment
Reel/Frame 055387/0431
Assignment of Assignor's Interest
Recorded: 2021-02-24
Pages: 2
Assignee
HITACHI METALS, LTD.
2-70, KONAN 1-CHOME, MINATO-KU, TOKYO, 108-8224, JAPAN
Covered Property
(1)
SiC WAFER AND MANUFACTURING METHOD THEREOF
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.