IP Library Granted Patent US 12,363,973
Granted Patent B2
US 12,363,973 · App. 17/183,549 · Granted Jul 15, 2025

SiC wafer and manufacturing method thereof

Inventors: Keisuke Kobayashi (Tokyo, JP); Akio Shima (Tokyo, JP)
Assignee: Proterial, Ltd.
H10D62/8325H01L21/02378H01L21/02447H01L21/02529H01L21/0262H01L21/0445H10D12/031H10D30/66
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Quick Facts
Patent No.
US 12,363,973
App. No.
17/183,549
Granted
Jul 15, 2025
Kind
B2
Abstract

A SiC wafer including a SiC substrate and an epitaxial layer formed on the SiC substrate and containing SiC is provided, and a composition ratio of C—Si of an upper surface of the epitaxial layer is 50 atm % or less.

Claims (23)

1. A SiC wafer comprising:

a SiC single crystal substrate;

a buffer layer made of SiC and formed on the SiC single crystal substrate; and

an epitaxial layer formed on the buffer layer and containing SiC,

wherein a composition ratio of C—Si bonds of an upper surface of the epitaxial layer is 50 atm % or less,

wherein the epitaxial layer is single crystal, and

wherein a composition ratio of C—O bonds of the upper surface of the epitaxial layer is 3.6 atm % or more.

2. A SiC wafer comprising:

a SiC single crystal substrate;

a buffer layer made of SiC and formed on the SiC single crystal substrate; and

an epitaxial layer formed on the buffer layer and containing SiC,

wherein a composition ratio of C—Si bonds of an upper surface of the epitaxial layer is 50 atm % or less,

wherein the epitaxial layer is single crystal, and

wherein a composition ratio of C—O bonds of the upper surface of the epitaxial layer is 10 atm % or more.

3. A manufacturing method of a SiC wafer comprising:

(a) preparing a SiC single crystal substrate;

(b) forming a buffer layer made of SiC and formed on the SiC single crystal substrate;

(c) forming an epitaxial layer on the buffer layer and containing SiC; and

(d) modifying a composition of an upper surface of the epitaxial layer, thereby setting a composition ratio of C—Si bonds of the upper surface of the epitaxial layer to 50 atm % or less,

wherein the epitaxial layer is single crystal, and

wherein, after the (d), a composition ratio of C—O bonds of the upper surface of the epitaxial layer is 3.6 atm % or more.

4. The manufacturing method of the SiC wafer according to claim 3 ,

wherein, after the (d), a sum of composition ratios of bonds containing carbon other than the C—Si bonds is larger than the composition ratio of the C—Si bonds in the upper surface of the epitaxial layer.

Assignments (2)
CHANGE OF NAME Recorded Apr 25, 2023
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 063442/0638 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: KOBAYASHI, KEISUKE; SHIMA, AKIO
To: HITACHI METALS, LTD.
Reel/Frame 055387/0431 →
Priority Claims (1)
JP 2020-037757 · Mar 5, 2020 · national
Continuity (1)
Related Publication 20210280677A1 · Sep 9, 2021
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