Patent Assignment
Reel/Frame 055391/0898
Assignment of Assignor's Interest
Recorded: 2021-02-24
Pages: 6
Assignors
KATO, KUNIHISA
Executed: 2020-11-11
MUTO, TSUYOSHI
Executed: 2020-11-11
TODAKA, MASAYA
Executed: 2020-11-11
KATSUTA, YUMA
Executed: 2020-11-10
Assignee
LINTEC CORPORATION
23-23, HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Thermoelectric Conversion Material Chip Manufacturing Method, and Method for Manufacturing Thermoelectric Conversion Module Using Chip Obtained by Said Manufacturing Method