Patent Assignment
Reel/Frame 055408/0026
Assignment of Assignor's Interest
Recorded: 2021-02-25
Pages: 8
Assignors
LAN, JE-HSIUNG
Executed: 2020-12-24
DUTTA, RANADEEP
Executed: 2020-12-30
KIM, JONGHAE
Executed: 2020-12-23
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Three-Dimensional (3D) Integrated Circuit with Passive Elements Formed by Hybrid Bonding