Patent Assignment
Reel/Frame 055412/0726
Assignment of Assignor's Interest
Recorded: 2021-02-25
Pages: 3
Assignors
LIN, MENG-HAN
Executed: 2021-02-03
HUANG, CHIA-EN
Executed: 2021-02-03
LIU, YI-CHING
Executed: 2021-02-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Common-Connection Method in 3D Memory