Patent Assignment
Reel/Frame 055430/0258
Assignment of Assignor's Interest
Recorded: 2021-02-26
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2020-08-19
SHIH, CHAO-WEN
Executed: 2020-08-20
YEH, SUNG-FENG
Executed: 2020-08-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer on Wafer Bonding Structure