Patent Assignment
Reel/Frame 055436/0038
Assignment of Assignor's Interest
Recorded: 2021-02-23
Pages: 383
Assignor
THE DOW CHEMICAL COMPANY
Executed: 2018-11-01
Assignee
DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
400 ARCOLA ROAD, COLLEGEVILLE, PENNSYLVANIA, 19426
Covered Property
(1)
Method for Bonding Using One-Component Epoxy Adhesive Mixtures
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 23, 2021
From: LUTZ, ANDREAS; SCHNEIDER, DANIEL; MAEDER, IRENE; ASCHWANDEN, MARCEL
To: DOW EUROPE GMBH
Reel/Frame 055373/0035 →
Assignment of Assignor's Interest
Feb 23, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055373/0116 →
Assignment of Assignor's Interest
Feb 23, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055435/0611 →
Change of Name
Feb 23, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 055454/0806 →