IP Library Assignment 055454/0806
Patent Assignment
Reel/Frame 055454/0806

Change of Name

Recorded: 2021-02-23 Pages: 7
Assignor
Assignee
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
974 CENTRE ROAD, BLDG 730, WILMINGTON, DELAWARE, 19805
Covered Property (1)
Method for Bonding Using One-Component Epoxy Adhesive Mixtures
Application: 17/049,080 →
Publication: US 2021/0237365
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2021
From: LUTZ, ANDREAS; SCHNEIDER, DANIEL; MAEDER, IRENE; ASCHWANDEN, MARCEL
To: DOW EUROPE GMBH
Reel/Frame 055373/0035 →
Assignment of Assignor's Interest Feb 23, 2021
From: DOW EUROPE GMBH
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055373/0116 →
Assignment of Assignor's Interest Feb 23, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055435/0611 →
Assignment of Assignor's Interest Feb 23, 2021
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 055436/0038 →