Patent Assignment
Reel/Frame 055494/0650
Assignment of Assignor's Interest
Recorded: 2021-03-04
Pages: 4
Assignors
CHEN, YUNG-HSIANG
Executed: 2020-09-14
YEH, YU-LUNG
Executed: 2020-09-14
CHEN, YEN-HSIU
Executed: 2020-09-14
SU, BO-CHANG
Executed: 2020-09-14
CHEN, CHENG-HSIEN
Executed: 2020-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Including Deep Trench Isolation Structure Comprising Dielectric Structure and Copper Structure and Method of Making the Same