Patent Assignment
Reel/Frame 055498/0988
Assignment of Assignor's Interest
Recorded: 2021-03-04
Pages: 7
Assignee
TTM TECHNOLOGIES INC.
200 EAST SANDPOINTE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Property
(1)
Three-Dimensional Circuit Assembly with Composite Bonded Encapsulation
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party's Data Previously Recorded at Reel: 055498 Frame: 0988. Assignor(S) Hereby Confirms the Assignment.
May 23, 2023
From: VESCE, JOHN, III; HEERY, JOSEPH WILLIAM, JR.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063729/0906 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →