Patent Assignment
Reel/Frame 055499/0880
Assignment of Assignor's Interest
Recorded: 2021-03-04
Pages: 3
Assignee
TOKYO OHKA KOGYO CO., LTD.
150, NAKAMARUKO, NAKAHARA-KU, KANAGAWA, KAWASAKI-SHI, 211-0012, JAPAN
Covered Property
(1)
Semiconductor Processing Liquid and Method for Processing Substrate