Patent Assignment
Reel/Frame 055506/0170
Assignment of Assignor's Interest
Recorded: 2021-03-05
Pages: 4
Assignors
CHIU, U-TING
Executed: 2020-06-30
YEH, PO-NAN
Executed: 2020-07-15
WANG, YU SHIH
Executed: 2020-06-30
LIN, CHUN-NENG
Executed: 2020-06-30
YEH, MING-HSI
Executed: 2020-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Feature of a Semiconductor Device and Method of Forming Same