Patent Assignment
Reel/Frame 055517/0805
Assignment of Assignor's Interest
Recorded: 2021-03-05
Pages: 9
Assignors
RYU, SEUNGMIN
Executed: 2020-12-15
KIM, JAEWOON
Executed: 2020-12-15
PARK, GYUHEE
Executed: 2020-12-15
CHO, YOUNJOUNG
Executed: 2020-12-15
SAITO, KAZUYA
Executed: 2021-02-25
KOIDE, TAKANORI
Executed: 2021-02-25
MANABE, YOSHIKI
Executed: 2021-02-25
AOKI, YUTARO
Executed: 2021-02-23
UCHIUZOU, HIROYUKI
Executed: 2021-02-25
FUSE, WAKANA
Executed: 2021-02-25
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME,, ARAKAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Organometallic Adduct Compound and Method of Manufacturing Integrated Circuit Using the Same