Patent Assignment
Reel/Frame 055535/0165
Assignment of Assignor's Interest
Recorded: 2021-03-09
Pages: 3
Assignors
SHI, HU
Executed: 2020-12-22
LIU, MENGBIN
Executed: 2020-12-22
XIANG, YANGHUI
Executed: 2020-12-22
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, 315800, CHINA
Covered Property
(1)
Fingerprint Identification Module, Method for Forming Fingerprint Identification Module, and Electronic Device