Patent Assignment
Reel/Frame 055543/0226
Assignment of Assignor's Interest
Recorded: 2021-03-03
Pages: 12
Assignors
AGASHE, SHASHANK SHRIKANT
Executed: 2020-09-15
KUMAR, GAURAV
Executed: 2020-09-24
KULASEKARAN, SATHYANARAYANAN
Executed: 2020-09-16
PARK, CHANWOO
Executed: 2020-10-22
CHO, YUNJE
Executed: 2020-10-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Estimating Heights of Defects in a Wafer by Scaling a 3D Model Using an Artificial Neural Network