Patent Assignment
Reel/Frame 055545/0119
Assignment of Assignor's Interest
Recorded: 2021-03-10
Pages: 6
Assignors
CHAE, SOO DOO
Executed: 2021-03-08
HAN, SANG CHEOL
Executed: 2021-03-09
PARK, YOUNGWOO
Executed: 2021-03-09
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method and Structures to Reduce Resistivity in Three-Dimensional Structures for Microelectronic Workpieces Using Material Deposited in Recesses at Edges of Holes in a Multilayer Stack