Patent Assignment
Reel/Frame 055548/0509
Assignment of Assignor's Interest
Recorded: 2021-03-10
Pages: 7
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Header for Semiconductor Package, and Semiconductor Package