Patent Assignment
Reel/Frame 055578/0947
Assignment of Assignor's Interest
Recorded: 2021-03-12
Pages: 2
Assignor
PARK, JIN KYOUNG
Executed: 2021-03-03
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stacked Semiconductor Chips