Patent Assignment
Reel/Frame 055585/0775
Assignment of Assignor's Interest
Recorded: 2021-03-15
Pages: 12
Assignors
SONG, SOLJI
Executed: 2021-03-02
KIM, BYEONGCHAN
Executed: 2021-03-02
PARK, JUMYONG
Executed: 2021-03-02
AN, JINHO
Executed: 2021-03-04
LEE, CHUNGSUN
Executed: 2021-03-02
JIN, JEONGGI
Executed: 2021-03-02
CHOI, JUIL
Executed: 2021-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package