Patent Assignment
Reel/Frame 055602/0037
Assignment of Assignor's Interest
Recorded: 2021-03-16
Pages: 9
Assignors
HEO, INKYOUNG
Executed: 2021-02-09
KIM, HYO-SUB
Executed: 2021-03-15
PARK, SOHYUN
Executed: 2021-03-16
PARK, TAEJIN
Executed: 2021-03-15
LEE, SEUNG-HEON
Executed: 2021-03-12
CHOI, YOUN-SEOK
Executed: 2021-03-15
HAN, SUNGHEE
Executed: 2021-03-16
HWANG, YOOSANG
Executed: 2021-03-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device Having Spacer Capping Pattern Disposed Between Burried Dielectic Pattern and an Air Gap and Method of Fabricating Same