Patent Assignment
Reel/Frame 055634/0264
Assignment of Assignor's Interest
Recorded: 2021-03-18
Pages: 6
Assignors
LEE, YONGKOON
Executed: 2021-03-02
KIM, JINGU
Executed: 2021-03-02
LEE, SANGKYU
Executed: 2021-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Method of Manufacturing Semiconductor Packages