Patent Assignment
Reel/Frame 055635/0296
Assignment of Assignor's Interest
Recorded: 2021-03-18
Pages: 2
Assignors
TSENG, CHUN-HAO
Executed: 2013-10-17
KUO, YING-HAO
Executed: 2013-10-22
YEE, KUO-CHUNG
Executed: 2013-10-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Thermally Conductive Structure for Heat Dissipation in Semiconductor Packages