Patent Assignment
Reel/Frame 055638/0308
Assignment of Assignor's Interest
Recorded: 2021-03-18
Pages: 4
Assignors
LUO, HAILONG
Executed: 2020-12-21
LI, WEI
Executed: 2020-12-21
QI, FEI
Executed: 2020-12-21
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
ROOM 309, AREA C, F3, BUILDING 1, NO.95, LANE 85, CAILUN ROAD, PILOT FREE TRADE ZONE, SHANGHAI, 201210, CHINA
Covered Property
(1)
Packaging Method and Packaging Structure of Film Bulk Acoustic Resonator
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.