Patent Assignment
Reel/Frame 064985/0392
Assignment of Assignor's Interest
Recorded: 2023-09-21
Pages: 3
Assignor
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
Executed: 2023-09-15
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, 315800, CHINA
Covered Property
(1)
Packaging Method and Packaging Structure of Film Bulk Acoustic Resonator
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.