Patent Assignment
Reel/Frame 055638/0692
Assignment of Assignor's Interest
Recorded: 2021-03-18
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2021-03-12
CHEN, WEI-YU
Executed: 2021-03-10
WU, JIUN YI
Executed: 2021-03-10
LIU, CHUNG-SHI
Executed: 2021-03-10
LEE, CHIEN-HSUN
Executed: 2021-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method