Patent Assignment
Reel/Frame 055683/0877
Assignment of Assignor's Interest
Recorded: 2021-03-23
Pages: 6
Assignors
PARK, JAEHYUNG
Executed: 2021-03-03
KIM, SEOKHO
Executed: 2021-03-03
NA, HOONJOO
Executed: 2021-03-03
SON, SEONGMIN
Executed: 2021-03-03
LEE, KYUHA
Executed: 2021-03-03
HONG, YIKOAN
Executed: 2021-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package for Improving Bonding Reliability