Patent Assignment
Reel/Frame 055697/0843
Assignment of Assignor's Interest
Recorded: 2021-03-24
Pages: 3
Assignors
LIAO, SIH-HAO
Executed: 2021-02-17
HU, YU-HSIANG
Executed: 2021-02-17
KUO, HUNG-JUI
Executed: 2021-02-17
YU, CHEN-HUA
Executed: 2021-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Polymer Layer in Semiconductor Device and Method of Manufacture