Patent Assignment
Reel/Frame 055732/0839
Assignment of Assignor's Interest
Recorded: 2021-03-26
Pages: 4
Assignors
TUNG, SZU-PING
Executed: 2021-01-08
CHEN, CHUN-KAI
Executed: 2021-01-08
LEE, TZE-LIANG
Executed: 2021-01-08
SU, YI-NIEN
Executed: 2021-01-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Patterning Material Including Silicon-Containing Layer and Method for Semiconductor Device Fabrication