Patent Assignment
Reel/Frame 055737/0012
Assignment of Assignor's Interest
Recorded: 2021-03-26
Pages: 3
Assignor
WANG, YU-SHIH
Executed: 2021-03-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition
Application:
17/195,211 →
Publication:
US 2021/0193517