Patent Assignment
Reel/Frame 055774/0704
Assignment of Assignor's Interest
Recorded: 2021-03-30
Pages: 6
Assignors
CHUNG, MYUNG KEE
Executed: 2021-03-26
CHUNG, HYUN SOO
Executed: 2021-03-26
YOO, TAE WON
Executed: 2021-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Pads with Stepped Structure