Patent Assignment
Reel/Frame 055775/0403
Assignment of Assignor's Interest
Recorded: 2021-03-30
Pages: 4
Assignors
WU, SUNG-YUEH
Executed: 2021-03-14
HWANG, CHIEN-LING
Executed: 2021-03-10
LIAO, JEN-CHUN
Executed: 2021-03-10
HSIEH, CHING-HUA
Executed: 2021-03-10
LEE, PEI-HSUAN
Executed: 2021-03-10
LIU, CHIA-HUNG
Executed: 2021-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof