Patent Assignment
Reel/Frame 055831/0759
Assignment of Assignor's Interest
Recorded: 2021-04-06
Pages: 6
Assignors
LEE, JAEJIN
Executed: 2021-03-18
KIM, HANA
Executed: 2021-03-18
PARK, JAEWHA
Executed: 2021-03-18
LIM, DONGCHAN
Executed: 2021-03-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Structure Having Double Capping Structure, Manufacturing Method Thereof, and Integrated Circuit Chip Having the Same