Patent Assignment
Reel/Frame 055836/0244
Assignment of Assignor's Interest
Recorded: 2021-04-06
Pages: 7
Assignors
LEE, DAIN
Executed: 2021-04-01
KANG, YOONGOO
Executed: 2021-04-01
YOO, WONSEOK
Executed: 2021-04-01
MA, JINWON
Executed: 2021-04-01
PARK, KYUNGWOOK
Executed: 2021-04-01
SEO, CHANGWOO
Executed: 2021-04-01
SONG, SUYOUN
Executed: 2021-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device Including Air Gap