Patent Assignment
Reel/Frame 055885/0303
Assignment of Assignor's Interest
Recorded: 2021-04-12
Pages: 4
Assignors
KAO, MIN-FENG
Executed: 2021-03-04
YAUNG, DUN-NIAN
Executed: 2021-03-14
LIU, JEN-CHENG
Executed: 2021-03-07
LIN, HSING-CHIH
Executed: 2021-03-04
LI, ZHENG-XUN
Executed: 2021-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof