Patent Assignment
Reel/Frame 055894/0234
Assignment of Assignor's Interest
Recorded: 2021-04-12
Pages: 9
Assignors
SONG, EUNSEOK
Executed: 2021-04-02
BAEK, HONGJOO
Executed: 2021-04-05
OH, KYUNGSUK
Executed: 2021-04-01
LEE, MANHO
Executed: 2021-04-01
LEE, HYUEKJAE
Executed: 2021-04-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Chip Having Bs-Pdn Structure